8.DURABILITY 耐久性

8.1

SLLDERING

TEST

可焊性试验

The tip of the terminals shall be

dipped 2mm in the solder bath at a

Temperature of 230±5℃ for 3±0.5sec.

端子顶部被浸入焊锡池2mm深,温度230±5℃

时间3±0.5秒.

A new uniform coating of solder Shall cover a minimum of 75% of the surface being immersed.

浸入的部分75%以上表面将被锡覆盖。

8.2

RESISTANCE

TO

SOLDERING

HEAT TEST

耐焊性试验

Solder bath method

Solder temperature 230±5℃

Immersion time 3±0.5scc

Immersion depth up to the surface of

the board

Thickness of PCB 1.6 mm.

焊炉焊的温度控制在230±5℃，过炉焊接的时间3±0.5秒，于(蒸板)厚度为1.6 mm.

Solder bath method

Bit temperature 300±10℃

application time 3±0.5scc

however excessive pressure shall not be applied to the terminal.

手焊接的时候温度需控制在300±10℃，时间为

3±0.5秒，但不能在排脚上施加异常压力。

Without deformation of case

Or excessive looseness of

mechanically electrical characteristics

Shall be satisfied.

本体无变形，能满足于机械、电器性能。

8.3

LIFI TEST

寿命试验

10000cycles of operation at a rate

of 15-18 cycles per minute with unloading.

无负载条件下,每分钟15-18次的速度操作10000次.

(1)Contact resistance接触阻抗.

100mΩ max.100毫欧以下.

(2)Operating force动作力. ±30%Inltial value.

变化范围初始值±30%.

(3)ITEN 项目—6.2

(4)ITEN 项目—6.3

(5)ITEN 项目—7.2

(6)ITEN 项目—7.3

8.4

HEAT TEST

耐热试验

80±2℃ for 96 hours , caner test keep

in normal condition for 30minutes.

在80±2℃环境中放96小时,再放在正常环境中

30分钟后进行测试.

(1)Contact resistance 150mΩ max.

接触电阻150毫欧以下.

(2)Insulation resistance

绝缘电阻.

50MΩmin 50兆欧以上.

(3)There shall be no sign of damage mechanically and electrically.

无任何迹象显示机械及电器性能之损坏.

8.5

HUMIDITY TEST

耐湿试验

40±2℃ 90-95%RH for 96firs after test

keep in mortal condition for 30 min.

在40±2℃ 90-95%RH环境中放96小时,再放在正常环境中,30分钟后进行测试.

8.6

COLD TEST

耐冷试验

At -20±3℃ for 96hours,after test

kept in normal condition for 30 min.

在-20±3℃ 环境中放96小时,再置于正常环境中,30分钟后进行测试.